Multichip Packages

Get critical features and functions to maximize your design — high performance, high quality, power efficiency, wide density ranges, small package sizes, industrial temperature ranges and more — from our broad portfolio of industry-standard multichip packages (MCPs).

By Technology

View part catalogs, download data sheets, and find other product information.
e.MMC-Based MCP
Quick look
  • Embedded managed NAND and High Performance LPDRAM in a single package
  • Simplified software solutions for complex high density NAND applications
  • Technology
    e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
UFS-Based MCP (uMCP)
Quick look
  • Embedded managed NAND and high-performance LPDRAM in a single package.
  • Enables high-density, low-power storage in a small footprint.
  • Technology
    LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
  • Densities
    UFS: 32GB; LPDRAM: 24Gb (3GB)
  • Package
    WFBGA
NAND-Based MCP
Quick look
  • Offers high densities for data-intensive applications
  • Provides high speeds, with x8, x16 and x32 bus widths
  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
  • Technology
    LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    NAND: 1Gb - 8Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
NOR-Based MCP
Quick look
  • Simplifies design while speeding performance for low-density applications
  • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
  • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
  • Supports low-voltage applications (1.8V)
  • NOR Densities
    32Mb - 512Mb
  • Voltage
    1.8V
  • Package
    TFBGA, VFBGA
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