MTFC32GAPALBH-IT

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Orderable parts

MTFC32GAPALBH-IT

Specs

  • Chipset Validation
    N/A
  • Density
    32GB
  • FBGA Code
    JZ132
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

8GB, 16GB, 32GB, 64GB, 128GB, e.MMC v5.1, 153-ball TFBGA (Industrial) Data Sheet

MTFC8GAMALBH-IT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: PDF
  • Updated: 2020-05-21
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REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 6/1/2023
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Simulation Models

IBIS embedded IT eMMC 5.1 (PS8226) - rev 1.9

MTFC8GAMALBH-AIT, MTFC8GAMALNA-AIT, MTFC16GAPALBH-AIT, MTFC16GAPALNA-AIT, MTFC32GAPALBH-AIT, MTFC32GAPALNA-AIT, MTFC64GAPALBH-AIT, MTFC64GAPALNA-AIT, MTFC128GAPALNS-AIT, MTFC128GAPALNA-AIT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: ZIP
  • Updated: 2022-01-04
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Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09
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TN-31-09: Automotive UFS VU Commands

This technical note describes Micron's vendor-unique (VU) commands for our Universal Flash Storage (UFS) 2.1 automotive devices.
  • File Type: PDF
  • Updated: 2022-07-29
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TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.
  • File Type: PDF
  • Updated: 2021-01-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06
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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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