MTFC32GAPALBH-IT

Orderable parts

MTFC32GAPALBH-IT

Specs

  • Chipset Validation
    N/A
  • Density
    32GB
  • FBGA Code
    JZ132
  • Op. Temp.
    -40C to +85C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.
  • File Type: PDF
  • Updated: 2021-01-25

TN-31-03: Best Practices for UFS Power Management

This technical note describes how to manage power up/off in customer systems that use Micron's Universal Flash Storage (UFS) 2.1 devices, as well as how to use the hardware reset function.
  • File Type: PDF
  • Updated: 2019-11-14
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
+