MTFC16GAPALBH-AIT

Contact Sales

Orderable parts

MTFC16GAPALBH-AIT

Specs

Chipset Validation

N/A
Density

16GB
FBGA Code

JWC70
Op. Temp.

-40C to +85C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x8

REACH Statement

Company statement regarding REACH SVHC compliance

File Type: (PDF)
Updated: 12/1/2023

Download

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

Download

TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.

File Type: PDF
Updated: 2021-01-25

Download

TN-31-03: Best Practices for UFS Power Management

This technical note describes how to manage power up/off in customer systems that use Micron's Universal Flash Storage (UFS) 2.1 devices, as well as how to use the hardware reset function.

File Type: PDF
Updated: 2019-11-14

Download

See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

Download

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

Download

See All