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TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms
This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.
CSN-24: ESD Precautions for Die/Wafer Handling and Assembly
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.