MTFC16GAPALBH-AIT

Orderable parts

MTFC16GAPALBH-AIT

Specs

  • Chipset Validation
    N/A
  • Density
    16GB
  • FBGA Code
    JWC70
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2023

Simulation Models

IBIS embedded IT eMMC 5.1 (PS8226) - rev 1.9

MTFC8GAMALBH-AIT, MTFC8GAMALNA-AIT, MTFC16GAPALBH-AIT, MTFC16GAPALNA-AIT, MTFC32GAPALBH-AIT, MTFC32GAPALNA-AIT, MTFC64GAPALBH-AIT, MTFC64GAPALNA-AIT, MTFC128GAPALNS-AIT, MTFC128GAPALNA-AIT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: ZIP
  • Updated: 2022-01-04

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-31-18: Enabling UFS 3.1 Features in UFS 2.x Mobile Platforms

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.
  • File Type: PDF
  • Updated: 2021-01-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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