Company statement regarding REACH SVHC compliance

MTFC8GAMALBH-AIT, MTFC8GAMALNA-AIT, MTFC16GAPALBH-AIT, MTFC16GAPALNA-AIT, MTFC32GAPALBH-AIT, MTFC32GAPALNA-AIT, MTFC64GAPALBH-AIT, MTFC64GAPALNA-AIT, MTFC128GAPALNS-AIT, MTFC128GAPALNA-AIT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note describes Micron's vendor-unique (VU) commands for our Universal Flash Storage (UFS) 2.1 automotive devices.

This technical note describes how to enable UFS 3.1 features in UFS 2.x mobile platforms, allowing manufacturers to quickly realize performance benefits without modifying their HW design.

Explanation of Micron packaging labels and procedures.

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.