MT48LC4M32B2B5-6A

Orderable parts

MT48LC4M32B2B5-6A:L

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    128Mb
  • FBGA Code
    D9NQR
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x32

Data Sheets

128Mb: x32 SDRAM

  • File Type: PDF
  • Updated: 2016-04-06

Simulation Models

HSpice

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2011-08-26

IBIS

2.0 (Die Rev. L)
  • File Type: ZIP
  • Updated: 2019-09-03

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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