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MT48LC4M16A2TG-6A

Orderable parts

Specs

Data Sheets

64Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2015-05-20

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.
  • File Type: PDF
  • Updated: 2009-11-19

TN-48-08: Designing in SDRAM for Future Upgrades

This technical note describes how to design in SDRAM for future upgrades
  • File Type: PDF
  • Updated: 2004-03-01
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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