MT62F512M32D2DS-031 WT

Orderable parts

MT62F512M32D2DS-031 WT:B

Specs

  • Ball Count
    315-pin
  • Chipset Validation
    N/A
  • Cycle Time
    6400 MB/s
  • Density
    16Gb
  • FBGA Code
    D8BCN
  • Op. Temp.
    -25C to +85C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR5
  • Width
    x32

Data Sheets

Production Data Sheet: 441b, 315b: x32/x64 LPDDR5 SDRAM (Y31M)

MT62F512M32D2, MT62F1G32D4, MT62F2G32D8, MT62F512M64D4, MT62F1G64D8
  • File Type: PDF
  • Updated: 2021-06-07

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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