MT53E768M32D4DT-053 AIT

Orderable parts

MT53E768M32D4DT-053 AIT:E

Specs

  • Ball Count
    200-ball
  • Chipset Validation
    N/A
  • Cycle Time
  • Density
    24Gb
  • FBGA Code
    D9WRS
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z1AM)

MT53E384M32D2, MT53E768M32D4
  • File Type: PDF
  • Updated: 2021-01-26

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2023

Simulation Models

HSPICE: 6Gb Mobile LPDDR4 Z1AM

6Gb Mobile LPDDR4, Die Rev. E, WT, XT, UT, AT, IT, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

IBIS: 6Gb Mobile LPDDR4 Z1AM

WT, XT, UT, AT, IT, Z1AM Mobile LPDDR4 SDRAM, Die Rev. E, 200b, 366b, 376b, 556b
  • File Type: ZIP
  • Updated: 2020-06-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-33: Micron BGA Manufacturer's User Guide

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
  • File Type: PDF
  • Updated: 2020-04-21
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