MT53E256M16D1, MT53E256M32D2

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

Company statement regarding REACH SVHC compliance

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B, 366b 8DP, 200b SDP, 200b DDP, 376b QDP

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note describes the quality and reliability requirements for bare die applications.

Explanation of Micron packaging labels and procedures.

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.