MT53D1024M32D4DT-046 WT

Orderable parts

MT53D1024M32D4DT-046 WT:D

Specs

  • Ball Count
    200-pin
  • Chipset Validation
    N/A
  • Cycle Time
    0.46ns
  • Density
    32Gb
  • FBGA Code
    D9WQG
  • Op. Temp.
    -25C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Production Data Sheet: 200b: x16/x32 LPDDR4/LPDDR4X SDRAM

MT53D512M16D1, MT53D512M32D2, MT53D1024M32D
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2023

Simulation Models

HSPICE: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-10-06

IBIS: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-10-06

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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