MT60B1G16HC-48B

Orderable parts

MT60B1G16HC-48B:A

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D8BNK
  • Op. Temp.
    0C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb DDR5 SDRAM Addendum

16Gb DDR5 SDAM Die Rev A
  • File Type: PDF
  • Updated: 2021-10-13

DDR5 SDRAM Data Sheet

MT60B4G4, MT60B2G8, MT60B1G16
  • File Type: PDF
  • Updated: 2021-10-13

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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