MT40A512M16JY-083E AUT

Orderable parts

MT40A512M16JY-083E AUT:B

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9VHC
  • Op. Temp.
    -40C to +125C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2023-03-14

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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