MT40A4G8BAF-062E

Orderable parts

MT40A4G8BAF-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9XQM
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 2019-07-31

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 3/1/2021

Simulation Models

32Gb x4/x8 DDP DDR4 IBIS: Z22A

Rev 1.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2020-03-10

32Gb x4/x8 DDP DDR4 SPICE: Z22A

Rev 1.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2020-10-05

Technical Notes

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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