MT40A4G8BAF-062E

Orderable parts

MT40A4G8BAF-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9XQM
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM

32Gb: x4x8, 1.2V TwinDie Dual Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 2019-07-31

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2020

Simulation Models

32Gb x4/x8 DDP DDR4 IBIS: Z22A

Rev 1.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2020-03-10

32Gb x4/x8 DDP DDR4 SPICE: Z22A

Rev 1.1 (Die Rev B)
  • File Type: ZIP
  • Updated: 2020-10-05

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-03: Using DDR4 in Networking Subsystems

This technical note focuses on using DDR4 in networking subsystems. It highlights the main benefits of DDR4 devices, as well as some of the constraints, to help system designers maximize the performance of their memory subsystems.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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