MT40A4G4FSE-083E

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Orderable parts

MT40A4G4FSE-083E:A

Specs

Chipset Validation

N/A
Density

16Gb
FBGA Code

D9SRN
Op. Temp.

0C to +95C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x4

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components

File Type: PDF
Updated: 2023-03-14

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide

File Type: PDF
Updated: 2020-09-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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