Orderable parts



  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    0C to +95C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Width

Data Sheets

8Gb: x4, x8 1.2V TwinDie DDR4 SDRAM

8Gb: x4, x8 1.2V TwinDie DDR4 SDRAM data sheet
  • File Type: PDF
  • Updated: 2015-09-01

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

HSpice - 8Gb DDR4 Twindie

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2014-07-11

IBIS - 8Gb DDR4 Twindie

2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2014-07-11

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-03: Using DDR4 in Networking Subsystems

This technical note focuses on using DDR4 in networking subsystems. It highlights the main benefits of DDR4 devices, as well as some of the constraints, to help system designers maximize the performance of their memory subsystems.
  • File Type: PDF
  • Updated: 2014-02-12
See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All