MT40A2G4SA-075

Orderable parts

MT40A2G4SA-075:E

Specs

  • Chipset Validation
    N/A
  • Density
    8Gb
  • FBGA Code
    D9VPS
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

8Gb: x4, x8, x16 DDR4 SDRAM

8Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2021-01-04

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2021

Simulation Models

8Gb DDR4 HSPICE: Z11B

Rev. 2.7.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2020-05-08

8Gb DDR4 IBIS: Z41C

Rev. 2.1 (Die Rev. R)
  • File Type: ZIP
  • Updated: 2021-02-02

8Gb DDR4 IBIS: Z11B

Rev. 2.8.2 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2021-01-12

8Gb DDR4 IBIS: Z21C

Rev. 2.2.1 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2020-08-20

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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