MT40A256M16LY-075

Orderable parts

MT40A256M16LY-075:F

Specs

  • Chipset Validation
    N/A
  • Density
    4Gb
  • FBGA Code
    D9WTF
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

4Gb: x4, x8, x16 DDR4 SDRAM

4Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

4Gb DDR4 Automotive HSPICE: Z10B

Rev. 2.2 (Die Rev. F)
  • File Type: ZIP
  • Updated: 2019-10-02

4Gb DDR4 HSPICE: Z10B

Rev. 2.2 (Die Rev. F)
  • File Type: ZIP
  • Updated: 2019-10-02

4Gb DDR4 IBIS: Z10B

Rev. 2.2 (Die Rev. F)
  • File Type: ZIP
  • Updated: 2019-10-02

DDR4 SDRAM Verilog Model

System verilog models for DDR4 SDRAM
  • File Type: ZIP
  • Updated: 2018-06-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-03: Using DDR4 in Networking Subsystems

This technical note focuses on using DDR4 in networking subsystems. It highlights the main benefits of DDR4 devices, as well as some of the constraints, to help system designers maximize the performance of their memory subsystems.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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