MT40A1G16RC-062E

Orderable parts

MT40A1G16RC-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D9XPG
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb: x4, x8, x16 DDR4 SDRAM

16Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2020-08-11

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

16Gb DDR4 Automotive HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 Automotive IBIS: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 IBIS: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-03: Using DDR4 in Networking Subsystems

This technical note focuses on using DDR4 in networking subsystems. It highlights the main benefits of DDR4 devices, as well as some of the constraints, to help system designers maximize the performance of their memory subsystems.
  • File Type: PDF
  • Updated: 2014-02-12
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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