MT40A1G16KH-062E AIT

Orderable parts

MT40A1G16KH-062E AIT:E

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D8BHP
  • Op. Temp.
    -40C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

16Gb: x8, x16 Automotive DDR4 SDRAM

MT40A2G8, MT40A1G16
  • File Type: PDF
  • Updated: 2020-07-30

Simulation Models

16Gb DDR4 Automotive IBIS: Z32D

Rev. 2.4.2 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2021-05-19

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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