MT41K2G4TRF-107

Contact Sales

Orderable parts

MT41K2G4TRF-107:E

Specs

Chipset Validation

N/A
Data Rate

DDR3-1866
Density

8Gb
FBGA Code

D9QBG
Features
Op. Temp.

0C to +95C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x4

Technical Notes

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

File Type: PDF
Updated: 2023-06-30

Download

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

Download

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life

File Type: PDF
Updated: 2009-12-15

Download

See All

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

Download

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

Download

See All