This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

Describes bypass capacitor selection for high-speed designs.

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life

Explanation of Micron packaging labels and procedures.

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.