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MT41K128M16JT-125 M AIT

Orderable parts

MT41K128M16JT-125 M AIT:K

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    2Gb
  • FBGA Code
    D9QXX
  • Features
    DDR3L-RS
  • Op. Temp.
    -40C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Technical Notes

TN-00-37: Relationship of Glass Transition Temperature (TG) to Operating Temperature (TO)

This tech note describes how glass transition temperature (TG) is measured and the relationship between TG and the operating temperature (TO) of Micron’s devices as stated in our data sheets
  • File Type: PDF
  • Updated: 2023-08-08

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.
  • File Type: PDF
  • Updated: 2023-06-30

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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