MT47H64M16HR-25E

Orderable parts

MT47H64M16HR-25E:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-800
  • Density
    1Gb
  • FBGA Code
    D9LHT
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-25

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-01-25

IBIS

2.5 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2013-08-05

1024Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18

TN-47-05: Power Solutions for DDR2 Notebook PCs

This technical note provides general guidelines for designing power circuitry for DDR2 memory; it includes the DDR2 voltage requirements and encompasses a sample reference design focused on the Texas Instruments Incorporated (TI) TPS51116 DDR2 memory power solution.
  • File Type: PDF
  • Updated: 2010-04-08
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Customer Service Notes

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2022-12-09

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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