2.3 (Die Rev. H)

2.5 (Die Rev. H)

5.83

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.

This technical note provides general guidelines for designing power circuitry for DDR2 memory; it includes the DDR2 voltage requirements and encompasses a sample reference design focused on the Texas Instruments Incorporated (TI) TPS51116 DDR2 memory power solution.

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.