MT47H512M4THN-3

Orderable parts

MT47H512M4THN-3:H

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR2-667
  • Density
    2Gb
  • FBGA Code
    D9LKQ
  • Op. Temp.
    0C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x4

Data Sheets

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2018-09-27

1Gb: x4, x8, x16 DDR2 SDRAM Addendum

  • File Type: PDF
  • Updated: 2014-09-30

2Gb: x4, x8 TwinDie DDR2 SDRAM

  • File Type: PDF
  • Updated: 2010-07-27

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01

IBIS

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-03-01

2048Mb DDR2 Verilog model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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