MT46V64M8P-5B IT

Orderable parts

MT46V64M8P-5B IT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR400B
  • Density
    512Mb
  • FBGA Code
    D9NHX
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

512Mb: x4, x8, x16 DDR SDRAM

  • File Type: PDF
  • Updated: 2011-07-28

Simulation Models

HSpice

2.0 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2011-01-12

IBIS

2.3 (Die Rev. J)
  • File Type: ZIP
  • Updated: 2019-09-03

Veriloq

  • File Type: ZIP
  • Updated: 2007-06-21

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-46-14: Hardware Tips for Point-to-Point System Design

This technical note provides hardware tips for point-to-point system design including termination, layout, and routing.
  • File Type: PDF
  • Updated: 2008-06-30

TN-46-02: Decoupling Capacitor Calculation for a DDR Memory Channel

Provides a decoupling capacitor calculation for a DDR memory channel
  • File Type: PDF
  • Updated: 2004-12-16
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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