HBM2E Memory

HBM2E is one of Micron’s high-bandwidth memories, designed for applications that demand maximum throughput between memory and processing. This performance is achieved by integrating TSV stacked memory die with logic in the same chip package. Micron’s extensive history in advanced memory packaging and stacking has made for a seamless entrance into this market. Micron is committed to providing high-bandwidth solutions, including HBM2E, HBM3E and future high-performance memory technologies.

HBM2E: Performance is everything

Solving the toughest challenges requires a compute foundation with fast memory. Our HBM2E delivers the necessary performance, massive parallelism and power efficiency for next-generation data centers and high-performance compute systems.

Integrating and Operating HBM2E Memory

Read our new tech brief for best practices from Micron experts on how you and your ecosystem of integrators can achieve maximum performance from the high-performance memory in Micron’s ultra-bandwidth solutions portfolio.

The stacked silicon miracles of high-performance memory

When nothing else matters but speed. Rebecca Lewington talks with Micron VP Akshay Singh, who leads the R&D team that created Micron’s amazing HBM2E memory in-package memory. TSV interconnect is just one thing that makes our stacked memory so fast.

HBM2E: The leader in high-performance memory

This infographic tells what HBM2E is, why it’s necessary for applications like AI and high-performance computing and why being closer to the CPU matters for high-bandwidth performance.

Density

Select Density

8GB
16GB

Range: 8GB - 16GB

Bus Width

x1024
Voltage

1.2V
Op. Temp.

0C to +95C

Bus Width

x1024
Voltage

1.2V
Op. Temp.

0C to +95C

HBM2E Catalogs

View 8GB Part Catalog View 8GB HBM2E Part Catalog

View Full Catalog View Full HBM2E Part Catalog

BLOG

Girish Cherussery on the technology and business of high-performance memory

Building one of the fastest, highest-performance memories on the planet demands a whole new level of collaboration.

BLOG

HBM2E: Our fast memory for the modern data center

High-performance applications like AI training and inference are driving the need for high-throughput memory. New memory approaches like HBM2E are often required for heterogenous data centers, which off-load some functions of the CPU to dedicated hardware (GPUs, ASICs and FPGAs) to gain speed and efficiency.

TECHNICAL BRIEF

The Demand for Ultra-Bandwidth Solutions

Driving the need for affordable Ultra-Bandwidth memory are data-hungry applications like AI, gaming, machine learning, autonomous driving, high-performance computing, virtual reality… GDDR6X raises Micron’s memory offerings to new heights, along with HBM2e and more.

Video

Addressing big science problems with GPU and high-performance memory

An expert panel at GTC 2021 discusses how compute and memory in the form of NVIDIA GPUs (A100), using high-performance memory (HBM2E), can enable high-capacity compute systems to process more than 100 petabytes per second.

View All