MT25QL256ABA8E14-1SIT

Orderable parts

MT25QL256ABA8E14-1SIT

Specs

  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    RW165
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Multi I/O Secure
  • Width
    x1/x2/x4

Data Sheets

MT25Q 256Mb, 3V, Multiple I/O Serial Flash Memory

MT25QL256ABA
  • File Type: PDF
  • Updated: 2018-07-22

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

MT25Q Security Addendum

The additional protection features available on the secure MT25Q device include a lock status register bit, top/bottom block address protection lock, volatile configuration lock register at power up, protection management register lock, and a nonvolatile configuration lock register.
  • File Type: PDF
  • Updated: 2017-08-10

Simulation Models

IBIS_MT25QL256ABAxxPP-xxTT v2.6.1

PP= 12, 14, SF, W9, W7. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2017-09-27

MT25Q_256Mb_3V_64KB_MicronXIP_Reset_Secure_VG13.tar

Verilog model, MT25QL256ABA8E1
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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