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Ultra-fast UFS

UFS (Universal flash storage) is a high-performance storage interface ideal for mobile, automotive and computing systems that require low power consumption, high performance and consistent reliability.

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UFS 3.1 and previous generations​

The Micron UFS 3.1 client storage device delivers industry-leading storage densities4 to enable flexible OEM designs that provide an optimal user experience for value-focused client platforms. Please visit UFS 3.1 client storage for more details.

1 Six-plane is for 512GB and 1TB only.

2 As compared to publicly available UFS 4.0 products performance, the statement is based on benchmark testing conducted in Micron labs.

3 Compared to previous generation, the statement is based on benchmark testing conducted in Micron labs.

4 Based on a survey of public material at the time of this document’s publication.

Density

Select Density
  • 32GB
  • 64GB
  • 128GB
  • 256GB
  • 512GB
  • 1024GB
Range: 32GB - 1TB
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C
  • Voltage
    2.4V–3.6V
  • Package
    FBGA
  • Protocol
    UFS 2.1, UFS 3.1, UFS 4.0​
  • Op. Temp.
    -25C to +85C, -40C to +95C, -40C to +105C

Benefits for mobile

UFS is the ideal interface for next-gen mobile devices, and here’s why:


  • Performance: enables much quicker load times for applications and files as well as faster device boot-up compared to e.MMC 5.1.
  • Multi-tasking responsiveness: provides a seamless experience when switching between multiple applications due to lower UFS latencies.
  • Camera performance: enables a significant increase in performance over e.MMC 5.1 when shooting bursts of photos or multiple photo stitches like panoramas due to higher memory interface bandwidth.
  • Richer content: enables seamless HD streaming and more graphically rich content (like in gaming) thanks to the faster read/write performance with UFS.

Learn more about Micron’s mobile memory and storage solutions, and the latest UFS 4.0, purpose-built for mobile.

Benefits for client computing

Micron UFS storage devices provide excellent performance with low power consumption and an outstanding thermal profile to deliver many benefits to client OEMs and end users:


  • Extends usable battery life: due to 70% less power usage during active use and 66% less power usage during sleep mode than other Micron client SSDs.1
  • Unprecedented PC design flexibility: dime-size footprint allows 88% more PCB area than M.2 to enable more space for other hardware or features.2
  • Hours of untethered performance: power efficiencies mean no thermal throttling due to overheating for prolonged productivity on the go.

1 Based of the datasheet power comparisons of the UFS FS194/195/196 versus that of the 2450 SSD.

2 Based of the datasheet form factor comparisons of the UFS FS194/195/196 versus that of the 2450 SSD.

Benefits for automotive

UFS enhances in-vehicle infotainment systems and instrument clusters in connected vehicles with its many benefits like these:


  • Superior performance: enables up to 941 MB/s reads and 651 MB/s writes, which means almost 3X faster reads and more than 2X faster writes than e.MMC interfaces.
  • Expanded temps: supports Automotive Electronics Council (AEC)-Q100 Grade 3 (40°C to 105°C) and AEC-Q100 Grade 2 (40°C to 95°C) temperature requirements.
  • High quality and reliability: complies with AEC-Q100 and Internal Automotive Task Force 16949 standards.
  • Cost-effectiveness: takes advantage of industry-leading 64-layer triple-level-cell 3D NAND with CMOS under array technology.

Learn more about Micron’s automotive memory and storage solutions.

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