MT48LC8M16A2P-6A IT

Orderable parts

MT48LC8M16A2P-6A IT:L

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    128Mb
  • FBGA Code
    D9NRK
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

128Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2014-09-09

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 3/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 3/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

LVTTL Derating for SDRAM Slew Rate Violations

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.
  • File Type: PDF
  • Updated: 2009-11-19

TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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