MT48LC16M16A2TG-6

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Orderable parts

MT48LC16M16A2TG-6A:G

Specs

  • Chipset Validation
    N/A
  • Data Rate
    PC133
  • Density
    256Mb
  • FBGA Code
    D9NNM
  • Op. Temp.
    0C to +70C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

256Mb: x4, x8, x16 SDRAM

  • File Type: PDF
  • Updated: 2015-05-20
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REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020
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Simulation Models

IBIS

2.0 (Die Rev. G)
  • File Type: ZIP
  • Updated: 2019-09-03
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64Mb - 512Mb SDRAM Verilog Model

Revision 2.3
  • File Type: ZIP
  • Updated: 2016-05-12
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Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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TN-00-19: Thinning Considerations for Wafer Products

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13
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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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