2.0 (Die Rev. G)

Revision 2.3

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

Describes the proper setup and hold time derating when the slew rate during transition time violates specification.

This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.

Explanation of Micron packaging labels and procedures.

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.