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MT53E256M32D2DS-053 WT

Orderable parts

MT53E256M32D2DS-053 WT:B

Specs

  • Ball Count
    200-ball
  • Chipset Validation
    N/A
  • Cycle Time
  • Density
    8Gb
  • FBGA Code
    D9WRB
  • Op. Temp.
    -30C to +85C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x32

Data Sheets

Data Sheet: 200b, x16/x32, Embedded LPDDR4/LPDDR4X SDRAM (Z00M)

MT53E256M16D1, MT53E256M32D2
  • File Type: PDF
  • Updated: 2021-02-23

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2024

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2024

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-53-09: LPDDR4/LPDDR4X Power Integrity Design Guidelines

This technical note describes how to build a power distribution network (PDN) for LPDDR4/LPDDR4X devices, including understanding JEDEC power requirements, estimating power consumption, and understanding PDN design flow and critical PDN design guidelines.
  • File Type: PDF
  • Updated: 2020-09-24

TN-42-02: LPDDR2 Dual Die Package to Single Die Package Migration

This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
  • File Type: PDF
  • Updated: 2014-12-18
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
See All
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