MT53E256M16D1DS-046 AAT

Orderable parts

MT53E256M16D1DS-046 AAT:B

Specs

  • Ball Count
    200-ball
  • Chipset Validation
    N/A
  • Cycle Time
  • Density
    4Gb
  • FBGA Code
    D9XFV
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR4
  • Width
    x16

Data Sheets

Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z00M)

MT53E256M16D1, MT53E256M32D2
  • File Type: PDF
  • Updated: 2020-10-27

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2023

Simulation Models

HSPICE: 4Gb LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B
  • File Type: ZIP
  • Updated: 2020-08-20

IBIS: 4Gb Mobile LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B, 366b 8DP, 200b SDP, 200b DDP, 376b QDP
  • File Type: ZIP
  • Updated: 2020-08-20

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-00-14: Understanding Quality and Reliability Requirements for Bare Die Applications

This technical note describes the quality and reliability requirements for bare die applications.
  • File Type: PDF
  • Updated: 2009-10-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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