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MT60B3G8RW-64B

Orderable parts

MT60B3G8RW-64B:B

Specs

  • Chipset Validation
    N/A
  • Density
    24Gb
  • FBGA Code
    D8DCP
  • Op. Temp.
    0C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

24Gb Die Revision B DDR5 SDRAM Addendum

24Gb DDR5 SDAM Die Rev B
  • File Type: PDF
  • Updated: 2024-01-08

DDR5 SDRAM Data Sheet

MT60B4G4, MT60B2G8, MT60B1G16, MT60B4G4HB-52B
  • File Type: PDF
  • Updated: 2022-10-18

Technical Notes

TN-00-37: Relationship of Glass Transition Temperature (TG) to Operating Temperature (TO)

This tech note describes how glass transition temperature (TG) is measured and the relationship between TG and the operating temperature (TO) of Micron’s devices as stated in our data sheets
  • File Type: PDF
  • Updated: 2023-08-08

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.
  • File Type: PDF
  • Updated: 2023-06-30

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09
See All

Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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