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MT40A2G8JE-062E AUT

Orderable parts

MT40A2G8JE-062E AUT:E

Specs

  • Chipset Validation
    N/A
  • Density
    16Gb
  • FBGA Code
    D8BHV
  • Op. Temp.
    -40C to +125C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15

TN-40-07: Calculating Memory Power for DDR4 SDRAM

Details of how DDR4 SDRAM consumes power and provides the tools that system designers can use to estimate power consumption.
  • File Type: PDF
  • Updated: 2018-08-14
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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