MT40A2G16SKL-062E

Orderable parts

MT40A2G16SKL-062E:B

Specs

  • Chipset Validation
    N/A
  • Density
    32Gb
  • FBGA Code
    D9XQF
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

32Gb: x16, 1.2V TwinDie Single-Rank DDR4 SDRAM

32Gb: x16, 1.2V TwinDie Single-Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 2019-08-27

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 4/1/2021

Simulation Models

32Gb x16 DDP DDR4 IBIS: Z22A

Rev 1.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2021-03-31

32Gb x16 DDP DDR4 SPICE: Z22A

Rev 1.0 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2020-07-29

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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