MT40A256M16GE-075E IT

Orderable parts

MT40A256M16GE-075E IT:B

Specs

  • Chipset Validation
    N/A
  • Density
    4Gb
  • FBGA Code
    D9THC
  • Op. Temp.
    -40C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

4Gb: x4, x8, x16 DDR4 SDRAM

4Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 3/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 3/1/2023

Simulation Models

HSpice: 4Gb DDR4 SDRAM Z90B

Model Revision 2.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2017-06-28

IBIS: 4Gb DDR4 SDRAM Z90B

Model Revision 2.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2017-04-18

Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2023-03-14

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide
  • File Type: PDF
  • Updated: 2020-09-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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