Rev. 2.4.2 (Die Rev. F)

Adding ECC With DDR4 x16 Components

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

DDR4 Point-to-Point Design Guide

Explanation of Micron packaging labels and procedures.

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.