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MT41K64M16TW-107 IT

Orderable parts

MT41K64M16TW-107 IT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    1Gb
  • FBGA Code
    D9SFZ
  • Features
  • Op. Temp.
    -40C to +95C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb: x4, x8, x16 DDR3L SDRAM

  • File Type: PDF
  • Updated: 2018-09-20

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2024

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2024

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Technical Notes

TN-00-37: Relationship of Glass Transition Temperature (TG) to Operating Temperature (TO)

This tech note describes how glass transition temperature (TG) is measured and the relationship between TG and the operating temperature (TO) of Micron’s devices as stated in our data sheets
  • File Type: PDF
  • Updated: 2023-08-08

TN-00-38: Anticipating ESD Technology Roadmap Trends

Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.
  • File Type: PDF
  • Updated: 2023-06-30

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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