MT41K512M16VRP-107 IT

Orderable parts

MT41K512M16VRP-107 IT:P

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    D9ZWN
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Sampling
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

8Gb: x16 TwinDie Automotive DDR3L SDRAM

MT41K512M16 – 64 Meg x 16 x 8 Banks
  • File Type: PDF
  • Updated: 2020-01-07

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2020

Simulation Models

HSPICE: 8Gb TwinDie x16 DDR3/DDR3L SDRAM

1.1 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2020-01-10

IBIS: 8Gb TwinDie x16 DDR3/DDR3L SDRAM

1.2 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2020-07-24

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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