MT41K512M16TNA-125 M

Orderable parts

MT41K512M16TNA-125 M:E

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1600
  • Density
    8Gb
  • FBGA Code
    D9QTJ
  • Features
    DDR3L-RS
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x16

Data Sheets

8Gb: x16 TwinDie DDR3L-RS SDRAM

  • File Type: PDF
  • Updated: 2013-05-07

Simulation Models

HSpice

1.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-05-15

IBIS

1.1 (Die Rev. E)
  • File Type: ZIP
  • Updated: 2013-05-15

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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