MT41K1G8SN-107

Orderable parts

MT41K1G8SN-107:A

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    8Gb
  • FBGA Code
    D9SDN
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    End of Life
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 3/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 3/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 3/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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