MT47H64M16NF-25E AAT

Orderable parts

MT47H64M16NF-25E AAT:M


  • Chipset Validation
  • Data Rate
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +105C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Width

Data Sheets

1Gb: x8, x16 Automotive DDR2 SDRAM

MT47H128M8, MT47H64M16
  • File Type: PDF
  • Updated: 2021-10-07

1Gb: x8, x16 Automotive AUT DDR2 SDRAM Addendum

MT47H128M8, MT47H64M16
  • File Type: PDF
  • Updated: 2018-06-29


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 4/1/2023

Simulation Models

HSpice: 1Gb DDR2 SDRAM U88B

Model Revision 2.1, Die Revision M, Temps include AIT, AAT and AUT
  • File Type: ZIP
  • Updated: 2015-10-12


Model Revision 2.2, Die Revision M, Temps include AIT, AAT and AUT
  • File Type: ZIP
  • Updated: 2016-02-05

1024Mb DDR2 Verilog Model

  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18

TN-47-05: Power Solutions for DDR2 Notebook PCs

This technical note provides general guidelines for designing power circuitry for DDR2 memory; it includes the DDR2 voltage requirements and encompasses a sample reference design focused on the Texas Instruments Incorporated (TI) TPS51116 DDR2 memory power solution.
  • File Type: PDF
  • Updated: 2010-04-08
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Customer Service Notes

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2022-12-09

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21
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