On Wednesday, Feb. 28, micron.com will be upgraded between 6 p.m. - 12 a.m. PT. During this upgrade, the site may not behave as expected and pages may not load correctly. Thank you in advance for your patience.

MT47H64M16HR-25E AAT

Orderable parts

Specs

Data Sheets

1Gb: x8, x16 Automotive DDR2 SDRAM

  • File Type: PDF
  • Updated: 2013-11-15

Simulation Models

HSpice

2.3 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2011-01-25

IBIS

2.5 (Die Rev. H)
  • File Type: ZIP
  • Updated: 2013-08-05

1024Mb DDR2 Verilog Model

5.83
  • File Type: ZIP
  • Updated: 2010-04-29

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-47-19: DDR2 (Point-to-Point) Features and Functionality

This technical note focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.
  • File Type: PDF
  • Updated: 2011-03-18

TN-47-05: Power Solutions for DDR2 Notebook PCs

This technical note provides general guidelines for designing power circuitry for DDR2 memory; it includes the DDR2 voltage requirements and encompasses a sample reference design focused on the Texas Instruments Incorporated (TI) TPS51116 DDR2 memory power solution.
  • File Type: PDF
  • Updated: 2010-04-08
See All

Customer Service Notes

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
+