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Given their potential to bring substantial benefits to your design wafer-level solutions are worth a closer look. Benefits like thinner packaging, custom packaging and custom solutions are appealing because they can reduce required board space. This is the case with packaging technologies such as systems-in-a-package (SIPs) and multichip packages (MCPs). The reduced trace lengths between bare die devices also enable higher-frequency operation which is needed as processor and bus speeds increase.
As compelling as those benefits are, there is also the convincing reason of cost savings. The cost savings comes from space savings (the memory is integrated inside) and reduced board cost (fewer layers and traces are required).
Micron’s bare die solutions combine these benefits with an ongoing commitment to deliver wafer-level products with reliability and quality levels that rival fully tested and burned-in packaged devices.
For more information about ordering bare die products directly from Micron, please contact us.
Read our frequently asked questions to find out more about wafer form, shipping, and thickness options of our bare dire products.