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Orderable parts

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Specs

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  • Chipset Validation
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  • FBGA Code
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  • Product Line
  • Product Longevity Program
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Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-47: 2100AI/AT PCIe Schematics Reference Design (Rev. E)

This document provides system design guidelines for PCI NVMe™ SSDs belonging to Micron's 2100AT/2100AI product family.
  • File Type: PDF
  • Updated: 2022-07-05

TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2021-04-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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