MTFDDAK480TGB-1BC1ZAB

Orderable parts

MTFDDAK480TGB-1BC1ZABYY

Specs

  • Capacity
    480GB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Interface
    SATA
  • Op. Temp.
    0C to +70C
  • Product Line
    5400 MAX
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
  • WRITE

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2023

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-10: P400e SSD SMART Implementation for FW0142

This technical note describes the SMART command (B0h) feature set for the P400e SSD.
  • File Type: PDF
  • Updated: 2012-12-12

TN-FD-06: P400e SATA SSD SMART Self-Test Reference

This technical note describes the self-test modes, commands, values, and result checks for the self-monitoring, analysis, and reporting technology (SMART) used for the P400e SATA SSDs.
  • File Type: PDF
  • Updated: 2011-12-19

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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