MTFDHBE3T8TDF-1AW1ZAB

Orderable parts

MTFDHBE3T8TDF-1AW1ZABYY

Specs

  • Capacity
    3.84TB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    End of Life
  • Product Line
    7300 PRO
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    3,000 MB/s
  • WRITE
    1800 MB/s

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2021-04-23

TN-FD-15: P320h/P420m SSD Performance Optimization and Testing

This technical note describes how to optimize and test the performance of the Micron P320h and P420m SSDs.
  • File Type: PDF
  • Updated: 2014-04-07

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
See All
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