MT44K64M18RB-093E

Orderable parts

MT44K64M18RB-093E:A

Specs

  • Chipset Validation
    N/A
  • Density
    1.125Gb
  • FBGA Code
    D9TJD
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    RLDRAM 3
  • Width
    x18

Data Sheets

1.125Gb: x18, x36 RLDRAM 3

  • File Type: PDF
  • Updated: 2019-01-18

1.125Gb: x18, x36 RLDRAM 3 Errata

  • File Type: PDF
  • Updated: 2016-09-21

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2020

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2020

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2020

Simulation Models

IBIS

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2016-09-12

HSPICE

Rev 2.0 (Die Rev. A)
  • File Type: ZIP
  • Updated: 2016-09-12

RLDRAM 3 Verilog Model

(Rev 1.20)
  • File Type: ZIP
  • Updated: 2015-05-07

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-44-01: RLDRAM 3 Design Guide

Contains practical recommendations for developing high-performance memory subsystems while ensuring stability for long-term reliable operation of the devices.
  • File Type: PDF
  • Updated: 2011-08-26
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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