MT40A512M8SA-075

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Orderable parts

MT40A512M8SA-075:F

Specs

Chipset Validation

N/A
Density

4Gb
FBGA Code

D9WTD
Op. Temp.

0C to +95C
Product Longevity Program

No
Product Longevity Program Start Date

N/A
Width

x8

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

File Type: (PDF)
Updated: 12/1/2023

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RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

File Type: (PDF)
Updated: 12/1/2023

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REACH Statement

Company statement regarding REACH SVHC compliance

File Type: (PDF)
Updated: 12/1/2023

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Technical Notes

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components

File Type: PDF
Updated: 2023-03-14

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TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

File Type: PDF
Updated: 2022-08-09

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TN-40-40: DDR4 Point-to-Point Design Guide

DDR4 Point-to-Point Design Guide

File Type: PDF
Updated: 2020-09-15

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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.

File Type: PDF
Updated: 2021-12-06

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CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.

File Type: PDF
Updated: 2009-04-06

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