Micron Introduces Automotive-Grade UFS Storage Portfolio to Deliver an Immersive Cabin Experience in Connected Vehicles

Infotainment systems in the enriched cabins of connected vehicles have advanced features like voice/image recognition and hand gesturing, along with high-resolution displays and artificial intelligence capabilities. These features require fast access to data to deliver an immersive user experience.

Micron is introducing a new Universal Flash Storage (UFS) portfolio that enables the high bandwidth, ultra-fast boot times and automotive-grade reliability required to bring this connected experience to life. Micron’s new UFS 2.1-compliant managed NAND storage solutions deliver up to three times the sequential read performance of our own e.MMC-based products. Using Micron’s 64-layer triple-level cell (TLC) 3D NAND architecture, our automotive UFS solutions are available in a broad range of cost-effective capacities from 32GB to 256GB.

Micron is working closely with automotive manufacturers and suppliers so that our UFS solutions have the performance, cost, quality, reliability and longevity required to run optimally in automotive environments. Micron’s UFS managed NAND portfolio of products is sampling to automotive customers today, with volume production expected in the third quarter of calendar year 2019.

Key Benefits

  • Superior Performance: Enables up to 941 MB/s reads and 651 MB/s writes, which means almost 3X faster reads and more than 2X faster writes than e.MMC interfaces.
  • Expanded Temps: Supports Automotive Electronics Council (AEC)-Q100 Grade 3 (40°C to 105°C) and AEC-Q100 Grade 2 (40 to 95°C) temperature requirements.
  • High Quality and Reliability: Complies with AEC-Q100 and Internal Automotive Task Force 16949 standards.
  • Cost-Effectiveness: Takes advantage of industry-leading 64-layer triple-level-cell 3D NAND with CMOS under array technology.