Micron recently announced our amazing new 3D flash memory technology, which has an astonishing 176 layers of memory cells stacked on top of each other. This announcement gave me the perfect excuse to sit down with Micron Senior Fellow Mark Helm to talk about how this achievement made the journey from idea to volume production — “from lab to fab,” as we say.
Why Mark? Well, over his 25-year career at Micron, he’s been involved with virtually every flash memory technology that Micron has produced. From pathfinding to process development, from circuit design to system engineering, he’s picked up a thing or two about flash memory along the way.
Mark is one of only four Micron senior fellows. You gain entrance to this exclusive club by making an industry-changing impact and having a track record of inventing technologies that are now used in major product lines.
Mark is also passionate about developing future technical talent within Micron. As he says, that’s about showing Micron team members that the work is “fulfilling and exceptionally challenging … and ultimately will transform the way the world uses information to enrich life. That’s a very compelling career to have pursued.”
I completely agree.
Learn more about how Micron 3D NAND flash technology at www.micron.com/products/nand-flash/3d-nand.